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In PCB market,
HDI technology required the adoption of
new technical skills, new machineries and the implementation of the related production processes including that of f
illing the through holes and laser holes, necessary for the realization of" filled and capped vias”, technique also known as "plating over filled vias” well described by the IPC 4761 standard as Type VII filling.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
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Stå för trädgårdsredskap, nödvändigt i alla trädgårdsverkstad, industriella. Spaden stativ kommer perfekt att komplettera utställningarna i butiken, i house and garden sektionen. Stabil konstruktion av pulverlackerad metall.
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Metall bokhylla för drycker med 4 våningar för hängande flaskor. hängare placerade i Coca-cola dryckesstället gör det enkelt att ta bort flaskor. Med den här lösningen kan du lagra en större del av produkten och göra den ännu mer tillgänglig för kunder vid försäljningsstället.
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Torun vodka-stativet hänvisar till en flaska från 1920-talet, designades och tillverkades för att öka synligheten för den eleganta flaskan och betona den unika exponeringen vid försäljningsstället. Solida hyllor gör det möjligt att lagra 70 flaskor och belysa dem med attraktiva produktpresentationer. På originalet presenterades varumärket, vilket ökade dess erkännande på marknaden.
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Pepparuppsättning med två soffbord, metallpulverbelagd konstruktion, bordsskiva med möbelplatta. Soffborden är inredda i minimalistisk stil, perfekt för modern inredning. Peppar soffbordsset tar inte mycket plats, du kan skjuta ett mindre bord under det andra eller ställa in med två separata
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feb 25 2021
Other
HDI technology for high-performance printed circuit boards
Datum: den 25 februari 2021 16:08
The global electronics market has been pushing for years towards increasing
miniaturization.
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
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Visa på Coca Cole som kombinerar exponeringar av enskilda produkter samt möjligheten att lagra fler varor. Råa trä- och metallelement betonar på ett originellt sätt de exponerade produkterna.
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Display avsedd för kakelexponering. Det möjliggör omfattande presentation av installationen av hela taksystemet tack vare användningen av: instruktionstavlor, broschyrer, videopresentationer och en tvärsnittsmodell av takkonstruktionen. Den roterande utformningen av stativet möjliggör bekväm visning av exponeringen, och bakgrundsbelysningen av produkten och logotypen drar till sig uppmärksamhet av den potentiella kunden.
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feb 9 2021
Other
IMPACT OF MOISTURE ON SOLDERING QUALITY OF ELECTRONIC COMPONENTS ON PCBs
Datum: den 9 februari 2021 07:52
In the previous technical article we illustrated
some defects generated on PCBs due to the presence of humidity.
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
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Oval spegel i en metallram betona stilen i inredningen. Spegelns metallram är ett karakteristiskt och uppmärksamhets-tilldreringselement. Oval spegel i metallram kommer att fungera i alla arrangemang. mått:100cmx70 cm
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Vinstället är gediget och hållbart, av metall. Vinstället har snäva hyllor som liknar en vin fat form. Underlättar organisationen av utställningen av 45 flaskor vin
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En tät väggspegel. Modellen har en rostfri ram, bra för badrum. De betonade perfekt arrangemangen av interiören i skandinavisk, modern stil. Spegelns form gör att du bekvämt kan använda produkten. Spegeldiameter 610mm
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I vårt erbjudande hittar du inte bara färdiga produkter utan även tjänster. En av dem är laserskärning av metall. Med hjälp av en laserstråle kommer vi att skära ut alla former som passar inom de tekniska funktionerna i våra maskiner. Du får initialt en mellanprodukt eller färdig produkt från oss – beroende på produktens syfte. Laserskärning används för bearbetning av konstruktionsstål, rostfritt stål och aluminium.
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Peppper ved stå - enkel konstruktion,pulverlackerad. Den öppna spisen står för trädet kan du ta med ordning i rummet där den öppna spisen är belägen. Placerad glänta i en monter för ved betona den moderna karaktären av interiören. Vedstå är en kombination av etetiskt och nytta skräddarsytt för varje vardagsrum med öppen spis.
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Oavsett årstid av glödlampor vi behöver varje dag Därför, investera i en multimedia display för presentation av glödlampor är alltid en bra idé Användningen av interaktiva element säkert lockar potentiella kunder, och de bakgrundsbelysta elementen och ursprungliga formen kommer att intressera alla utan undantag.
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CNC fräsning är en av de mest använda metoderna för bearbetning av metall, plast och trä. Med hjälp av olika blad, kan du få de mest olika formerna i metall, plast, plywood, trä. Tack vare CNC-fräsning uppnår vi hög precision, exakta element, enligt konstruktionen. Vi fräs storlek 2750x1500mm.
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Multimedia stand - iögonfallande och uppmuntrar till interaktion. Den var gjord av pulverlackerad metall i sin inuti placerade tablett. Till stativet valfritt kan vi lägga hyllor för mappar, produkthängen, etc. Med hjälp av tabletten kan vi presentera produkten och även införa kundinteraktioner. I detta fall är montern tillägnad marknadsföring av barnartiklar men kan också användas för att marknadsföra andra produkter.
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Smple hygieniska stationer komplett, fristående hand sanitizer stationer kontrolleras av fotpedal behöver inte ström, akumaltorów kapacitet 1 liter, pumpflaska ingår i uppsättningen av hela av metall, pulverlackerade
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